Now the trend is recommended for all components of the double glue points, and located in the outer edge of the element, the bonding quality assured, in other words, even if one of the gel point appear quality problem, there is a glue points have the effect of coherence. Glue point location is located in the components of the lateral also give attention to two or morethings arrives and welding plate is increased, the relative position can also prevent excessive bond, bring difficulty to maintenance point glue machine. In addition, you can put the hot curing adhesive needed position and the position of the light curing glue need to two or morethings.

For SOIC, generally set up three or four points, that is better than using only two points, can not only increase can also play a role in seismic intensity, because before curing glue, bond strength is always limited, for larger devices, because of the increase in weight, motion inertia will increase. Quality of the larger IC on the gel point, if only two point glue, give a person a kind of the feeling of floating, a vibration, can appear "slip", increase the glue points also to increase the bonding area, to prevent the major components of "slip" can play a good defensive role.